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Long-wavelength VCSELs: a green solution to high-speed communication
11/02/2010
Long-wavelength VCSELs (Vertical-Cavity Surface-Emitting Lasers) for the next generation of high-speed communication systems have been developed in the European project MOSEL, a three-year joint research program lead by CEA-Leti.
Quelles interactions entre Biologie Synthétique et Micro-Nanotechnologies ? Le 30 mars 2010, Minatec, Grenoble
09/02/2010
Réunir des scientifiques de diverses disciplines, biologistes, chercheurs en microtechnologies et microfluidique, informaticiens , afin de les éclairer sur la biologie synthétique, sur les idées nouvelles issues de cette démarches d'enginerie en biologie et susciter une curiosté et un intéret réciproque sont les objectifs principaux de ce séminaire.
Sixième Conférence Internationale sur la Communication et la Coopération en Nanotechnologies - 17-20 mai 2010 - Grenoble - Minatec / France
07/02/2010
« Favoriser la communication et la coopération en nanotechnologies entre les organisateurs, leurs promoteurs et la communauté scientifique mondiale en vue de stimuler et soutenir la croissance économique au 21ème siècle »
Ouverture d’un web TV à MINATEC IDEAs Laboratory®
07/02/2010
Après le succès du 4ème IDEAs Day Forum PARTAGE (Energie, Mobilité, Habitat), MINATEC IDEAs Laboratory ® met en ligne les vidéos couvrant l’intégralité de la conférence.
Three-year common lab agreement to develop 3D design methodologies for consumer and wireless applications
20/01/2010
Leti and R3Logic, a leading 3D IC EDA company, announced that they will combine their expertise in 3D silicon integration and packaging. Under the terms of the common laboratory agreement, they will use new generation EDA tools provided by R3Logic to build 3D IC designs and methodologies for consumer and wireless applications.
19-partner project to maintain Europe’s leadership in integrating photonics and CMOS combines top R&D labs and companies’ commercialization expertise
19/01/2010
Leti, coordinator of the pan-European consortium HELIOS announced that the 19 partners have met or exceeded their phase-one goals for the large-scale CMOS photonics project.
OSEO attribue une aide de plus de 21 M€ au projet PRIIM (Projet de Réalisation et d’Innovation Industrielle dédié aux Microsystèmes hétérogènes)
19/01/2010
OSEO soutient le projet PRIIM qui vise la création d’une offre industrielle conjointe de composants passifs intégrés (IPD) sur silicium et de technologies de packaging avancés pour la miniaturisation (SiP :System in Package), ouverte et indépendante des grands fondeurs.
STMicroelectronics joins the CEA-Leti IMAGINE program to develop multiple e-beam lithography
18/01/2010
STMicroelectronics and CEA-Leti have signed an agreement for STMicroelectronics to join the new industry/research multi-partner program IMAGINE, led by CEA-Leti, which includes TSMC, for mask-less lithography for IC manufacturing.
Leti’s Planar-SOI Technology Meets Low-Power, 22nm Node Requirements, Supports Development of “Green” Products
15/10/2009
Leti presented results at the SOI Industry Consortium workshop in Leuven, Belgium, that prove SOI-based planar CMOS meets requirements for low-power, 22nm node devices, offering a practical route to further feature shrink and enabling a significant jump for “green” products.
Leti Achieves Groundbreaking Discovery in Using Copper-based Catalysts to Synthesize Silicon Nanowire
06/10/2009
Project Demonstrates that Silicon Nanowire Synthesis can be CMOS-Compatible
Leti, announced that it has broken new ground in the integration of nanotechnology with traditional complementary metal oxide semiconductor (CMOS) chip technology. CMOS is the most widely used technology for manufacturing silicon integrated circuits.
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