CEA-Leti, a recognized leader in 3D integration R&D, will significantly expand its technology offering this month when it ramps up one of Europe’s first 300mm lines dedicated to 3D-integration applications.
By adding this technology to its existing 300mm CMOS R&D line, Leti now can offer heterogeneous integration technologies to customers on both 200mm and 300mm wafers.
The new line, dedicated to R&D and prototyping, includes 3D-oriented lithography, deep etching, dielectric deposition, metallization, wet etching and packaging tools that will be available for Leti’s customers and partners around the world.
It will allow Leti to apply its 3D-integration generic processes on 300 mm wafers. This 3D toolbox includes a large portfolio of through-silicon vias (TSVs), and advanced capabilities in alignment, bonding, thinning, and interconnects in specific integration schemes for manufacturing optimized die stacks and building efficient advanced-systems solutions. This will be done in close collaboration with local design and characterization platforms.
“This extension offers important new capabilities to equipment manufacturers and other Leti partners,” said Laurent Malier, CEO of Leti. “Together we will demonstrate 3D and heterogeneous integration technologies on 300mm wafers.”
+33 4 38 78 39 22