Preliminary results using a 3D integration technology for hybrid pixel detectors designed for particle physics and imaging experiments :

Minapad 2012 presentation (2.45 MB)

Conference program :

Conference program - MiNaPAD 2012 (2.92 MB)

More information : http://france.imapseurope.org/

• What is 3D Integration ?

In electronics, a 3D integrated component is a device in which at least 2 active layers have been vertically integrated in order to achieve a new component or a system.
Those layers could be homogeneous or heterogenous in term of component function, material, substrate sizes or technological node.

• What are the main interest of 3D integration ?

• form factor decrease:
  final device miniaturization (X,Y, Z)
  
  
• performance improvement:
  - resistance and parasitic capacitance decrease, signal propagation rate increase.
  - bandwidth increase
  - reduction of power consumption
  
  
• heterogeneous integration:
  - logic / analog components
  - memories
  - sensors / MEMS
  - passives components
  - energy sources
  …
  
  
• cost reduction
  - active silicon surface reduction
  - advanced & mature technologies partitioning
  - legacy production line reuse

• What are the key interest for you to work with Open 3D ?

• to boost your innovation by:
  - product performance improvement
  - targeting new products, new applications, new markets and new customers
  
  
• to promote your products with the opportunity to:
  - customizing your components
  - limiting the cost
  - optimizing the cycle time of the project
  - having a global offer including design, technology, test. Packaging is also possible with a partner.
  - achieving proof of concept (small quantity of wafers), prototyping or small volume production
  
  
• accessing innovative technologies
  Technological modules catalogue:

Technological offer (1.23 MB)

• to collaborate with international experts in the following areas:
  - design / masks
  - technologies & processes
  - metrology / characterization
  - reliability
  
  
• to benefit to a high level quality approach:
  ISO 9001 certification

• What are the Open 3D means & facilities ?

• international environment of the Minatec campus
  
  
• 10 000 m² of clean rooms and laboratories supporting 200mm by now and 300 mm wafer format at the end of 2012
  
  
• high level technological platforms:
  - design
  - MEMS 200
  - 3D 300 line (end of 2012)
  - test and characterization

• How to work with Open 3D ?