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Collaborating with Leti

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Leti 3S


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Contacts:

  • jean-francois.teissier@cea.fr
  • eric.rouchouze@cea.fr



LETI-3S OFFER: A NEW WAY TO COLLABORATE WITH CEA-LETI


The CEA-Leti owns a very high performance and well equipped silicon platforms to perform most of the R&D studies it has in charge. The CEA-Leti’s extensive range of collaborative solutions for businesses usually includes, R&D collaboration projects, bilateral agreements, joint laboratory or technology transfer.




Do you know there is a simple way to accede to these first-class infrastructures to realize:

  • Advanced single step processes to high end process modules to make some or your entire product or establish a proof of concept demonstration.
  • Flexible customer owned processes to meet small manufacturing requirements, through prototyping, or even small pre-series before transfer to commercial foundries
  • Equipment access or consumable test through the expertise of CEA-Leti experts
  • In-line advanced characterization


This is the LETI-3S for « Silicon Specialty Solutions » concept, recently highlighted by CEA-Leti.




Who should be concerned by this offer?

  • Start-ups
  • Component integrators,
  • Fabless or fablite,
  • Consumable or equipment suppliers,
  • Foundries or research centers with a limited processes offer,
  • Micro and nanotechnologies companies who don’t want low-volume activities,
  • High-value silicon wafers dealers,…


We propose adapted solutions to answer your unique or recurring requirements.



LETI-3S addresses following main domains:



We are thus able to propose process steps which became standards in CEA-Leti but which are still advanced, or even research ones for most of the industrials we are dealing with.




What are Leti 3S means & facilities ?


The employed capital goods are those from the CEA-Leti platforms with more than 500 equipment’s on 80k sq. ft. clean room:

  • CMOS 200mm and 300mm
  • 3D 200mm and 300mm
  • MEMS 200mm
  • MEMS & CMOS 200mm co-integration


By the way, we can make process on lower wafer diameters size via an innovative holder technology. Moreover, we can envisage other types of substrates material such as glasses, quartz, sapphire, III-V,… on thicknesses different from standards.



If your request includes lithography:

  • Design is becoming from customer and we adapt the gds files to our lithography tools.
  • We put at your disposal generic masks coming from our library if your need is not a specific one.


The CEA-Leti is ISO9001:2008 certified for many years. LETI-3S insure a full traceability from process flow conception to shipping of the goods through travelers and performing Manufacturing Execution System (MES). We can implement Statistics Process Control (SPC) and/or Failure Modes and Effects Analysis (FMEA). Audits may also be organized on demand.


CEA-Leti’s is committed to protecting customer’s IP and maintaining the confidentiality of all projects.


Boosted by 5 years of experience and more than 300 LETI-3S studies, we are fully committed to deliver a high quality supplying, in a short time thanks to the 24/7 operations and maintenance teams work.




HOW TO PROCEED?

We will analyze together your specifications demands. We can deliver conformance certificates at the end of our achievements. All these data will be very helpful to prepare a transfer to a commercial foundry. We thus achieve the ideal link between lab and fab.


To contact us, simply send an e-mail to the following address LETI-3S@cea.fr indicating your name and address and explicating your requirement(s). We’ll shortly give you an answer to study together the feasibility of your request (on technological and commercial aspects) before to send you a formal quote.


LETI-3S gives you access to an innovative technologies very abundant catalog and to a worldwide recognized teams experience, as a part of the MINATE Campus.




Some latest achievements examples:


  • 300mm chucks for equipment supplier,
  • «Ultra-low-k » depositions on 300mm wafers,
  • Short loops wafers with various depositions types for test and qualification of new tools supporting a wafer size increasing project
  • Magnetic layers deposition and annealing
  • Silicon micro needles for clinical tests before industrialization
  • Contaminant materials identification in gases or liquids
  • Thin wafers bonding…

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