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> Packaging and ReliabilityPackaging and Reliability
Contact: Gilles Poupon (gilles.poupon@cea.fr)
3D packaging and life-time reliability testing
Leti develops packaging technology and processes harsh environments, flexible substrates and biocompatibility with the human body for medical applications.
A significant part of this effort is development of testing procedures that ensure high yields, extended lifetimes, reliability, and the lowest possible production costs.
Examples: testing MEMS components at different stages of fabrication and after packaging and assessing the lifetime reliability of components that we develop with our partners.
Substrate CIWIS
Our chip-in-wafer-for-integrated-system project is designed to build the system at the wafer level from heterogeneous chips.
Tailor-made solutions:
-develop hermetic packaging that uses standard flip-chip technology but adds compatibility with MEMS devices having on-board vacuum
-increase yield in LEDs through a specific thermal-management substrate layer.
Beyond the reliability of its components, Leti guarantees the industrial transfer of its technology:
-reliable microsystems laboratory of characterization created to evaluate all MEMS components and devices designed with our partners
-characterization of components due to specific instrumentation, through 200mm forks, sometimes composed of nearly 20,000 bare or packaged components
Driven by our commitment to innovation
- In 2008, Leti and Brewer Science Inc. completed the first full integration process involving ultra-thin wafer processing flows for 3D packaging.
- Leti has been collaborating with 3D Plus on package-in-a-package technology to enable 3D wafer stacking.
- Our hermeticity project involves development of eutectic sealing based on gold-tin alloy. Leti developed a process flow with eutectic sealing wafer-to-wafer, requiring deposition on sealing ring and pad with a gap thickness of less than 10µm.
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