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Nanotechnologies


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Nanotechnologies

Contact: Jean-Christophe Gabriel (jean-christophe.gabriel@cea.fr)

Engineering atomic-scale performance

Leti is building the fundamental toolset engineers will need to address sub-22nm design and fabrication.

New patterning and metrology techniques have allowed researchers to study the unexpected behavior of nanometer-scale materials and structures. Nanotechnology seeks to exploit these newly discovered properties in applications such as smaller transistors, better optical filters, and improved heat dissipation.


Leti is building the scientific foundation for nanoscale devices:

-simulations and experimental techniques to benchmark nanoscale materials and structures
-new metrology techniques to support non-destructive imaging and characterization of sub-20nm features
-development of process technologies that can move nanoscale fabrication from individual custom-made devices to wafer-scale mass production



More about Nanoworld: video

The smaller the material, the larger Leti’s expertise

-Graphene is a nanometer-scale relative of graphite, consisting of just a few atomic layers of carbon. A graphene ribbon can be either metallic or semiconducting depending on the orientation of its edge relative to the layer's atomic structure. As a prelude to development of graphene devices, Leti together with INAC, CNRS-LTM and Institut Néel modeled the addition of dopants to pure graphene sheets.


-Nanometer-scale metallic structures, which allow more complex photonic functionalities to be integrated in smaller volumes, have many possible mass market applications such as memories, optical filters, detectors and emitters. By using nanoimprint lithography for imprinting a polymer coating on the wafer surface, is quicker and more economical than electron-beam lithography, Leti is revolutionizing the production of these structures. Leti's 20nm imprint lithography features achieve quality comparable to electron-beam exposure.

MORE :

Lithography  |  Materials for Microelectronics  |  Micro- and Nanoelectronics Devices
Advanced Substrates  |  3D Integration  |  Packaging and Reliability
Sensors Processes  |  Microfluidics  |  Plasmonics
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