Francais | English



Home
Discover Leti
About us
Leti's environment
Leti's research
Application fields
Integrated components
Basic technologies
Innovation platforms
Partnerships
Documents
Books
How to collaborate
Collaborating with Leti
Innovation platforms
Success stories
Join us
Welcome to CEA-Leti
Work at Leti's
Discover micro and nanotechnologies
Latest news
Press
Press releases
Press partner
Media

Leti, innovation
for industry


Home

>

Discover Leti

>

Leti's research

>

Basic technologies

> Materials for Microelectronics

Materials for Microelectronics


Print Send by mail
Devices micro-électtronique Devices micro-électronique

Contact: Jean-Jacques Aubert (jean-jacques.aubert@cea.fr)

Improving performance and lowering costs through material innovation

For several years, Leti has been involved in the development of advanced CMOS gate materials in order to improve transistor performance through better gate current and less power consumption. In 2008, we replaced the classic polysilicon-oxinitride gate stack with High-k/metal gate stacks.

Despite optimizations on refractory metal nitride, this new architecture reveals a significant degradation of mobility and reliability.

Leti, in collaboration with various industrial partners, identified the cause of these problems: nitrogen in the metal diffuses at the High-k/metal interface during the different furnace processes.

Leti solved these problems by presenting a range of products: the new High-k material associated with metal gates has obtained an EOT value less than 1nm. We continue to optimize advanced High-k/metal gate stack to address both aggressive EOT and reliability for future technology generations.

Nanowires and CMOS Circuits: towards technology transfer

Potential nanowire applications range from electronics to optics, biology, and energy, but the field is still mainly restricted to basic science.

The major bottleneck to transferring nanowires to industry is the lack of a CMOS-compatible process catalog. In 2008, Leti demonstrated that fully CMOS-compatible silicon nanowires growth is possible.

MORE :

Lithography  |  Micro- and Nanoelectronics Devices  |  Advanced Substrates
Nanotechnologies  |  3D Integration  |  Packaging and Reliability
Sensors Processes  |  Microfluidics  |  Plasmonics
  • Contact
  • Sitemap
  • Legal information
  • MINATEC
  • CEA