Advanced lithography applies new tools to an old problem Further increases in integrated circuit density depend on continued improvements in lithography. Leti, like the industry as a whole, is pursuing alternatives from advanced deep ultraviolet exposures to massively parallel electron beam writing.

Improving performance and lowering costs through material innovation For several years, Leti has been involved in the development of advanced CMOS gate materials in order to improve transistor performance through better gate current and less power consumption. In 2008, we replaced the classic polysilicon-oxinitride gate stack with High-k/metal gate stacks.

Moving circuits into three dimensions New processes — from three-dimensional multi-gate structures to ultrathin silicon and germanium layers — push transistor technology forward.

Going beyond silicon to create new applications Leti spinout SOITEC has become the world leader in silicon-on-insulate (SOI) substrates. Today, Leti and Soitec are developing a wide range of innovative substrates for new applications and capabilities, including logic, networking, and photovoltaics.

Engineering atomic-scale performance Leti is building the fundamental toolset engineers will need to address sub-22nm design and fabrication.

A versatile 3D toolbox Leti’s extensive experience in MEMS, microelectronics, and device design has enabled exploration of a wide range of 3D integration techniques that promises to bring new levels of performance and capability to electronic systems. With several partners, we have formed better interconnects among stacked arrays of devices, and transferred Leti-developed technologies for use in production.

3D packaging and life-time reliability testing Leti develops packaging technology and processes harsh environments, flexible substrates and biocompatibility with the human body for medical applications.

Towards a smaller future Developing MEMS, “M&Ns” and NEMS process flows for future sensors

Developing more precise techniques Leti is developing multiple microfluidic techniques for managing very small quantities of liquid at the micro scale. With most of the basic processes now stabilized, the challenge is to integrate multiple steps into complete microsystems for analyzing water, blood and other biological substances.

Manipulating light with nanostructured metal Leti supports plasmonic devices with new manufacturing techniques and state-of-the-art characterization and simulation tools.